4. Metal working
  5. Barrier layer or semiconductor device making

Rich Fogal

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Angularly offset and recessed stacked die multichip device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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Angularly offset and recessed stacked die multichip device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Angularly offset stacked die multichip device and method of manu

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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Angularly offset stacked die multichip device and method of manu

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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Angularly offset stacked die multichip device and method of manu

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent

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Profile ID: LFUS-PAI-P-169141

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