Angularly offset and recessed stacked die multichip device

Details Angularly offset and recessed stacked die multichip device Angularly offset and recessed stacked die multichip device

1997-10-03

1999-03-23

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257784, 257686, H01L 2348, H01L 2302

Patent

active

058864121

ABSTRACT:
An offset die stacking arrangement is disclosed having at least one upper level die having a width which is less than the distance separating the opposing bonding sites of the underlying die. The lowest die is affixed to the substrate within a recess in the substrate. The upper die is fixed above the lower die and rotated within a plane parallel to the lower die through an angle which insures that none of the bonding sites of the lower die are obstructed by the upper die. Once the dice are fixed in this manner, the entire assembly is subjected to the wire bonding process with all of the bonds being made in the same step.

REFERENCES:
patent: 5422435 (1995-06-01), Takiar et al.

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