4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

Rajiv Rastogi

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Interface between titanium and aluminum-alloy in metal stack for

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Method of copper electroplating to improve gapfill

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...
Reexamination Certificate

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Single step salicidation process

Fishing – trapping – and vermin destroying
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Using cell voltage as a monitor for deposition coverage

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Involving measuring – analyzing – or testing
Reexamination Certificate

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Using cell voltage as a monitor for deposition coverage

Chemistry: electrical and wave energy – Apparatus – Electrolytic
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Profile ID: LFUS-PAI-P-132775

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