Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...
Reexamination Certificate
2004-09-30
2008-10-21
Tsang-Foster, Susy (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal or alloy coating on...
C205S123000, C205S137000, C205S296000
Reexamination Certificate
active
07438794
ABSTRACT:
A copper electroplating bath composition and a method of copper electroplating to improve gapfill are provided. The method of electroplating includes providing an aqueous electroplating composition, comprising copper, at least one acid, at least one halogen ion, an additive including an accelerating agent, a suppressing agent, and a suppressing-accelerating agent, and the solution and mixture products thereof; contacting a substrate with the plating composition; and impressing a multi-step waveform potential upon the substrate, wherein the multi-step waveform potential includes an entry step, wherein the entry step includes a first sub-step applying a first current and a second sub-step applying second current, the second current being greater than the first current. The accelerating agent is provided in concentration of greater than 1.5 ml/liter, the suppressing agent is provided in concentration of greater than 15 ml/liter, and the accelerating-suppressing agent is provided in concentration of greater than 10 ml/liter.
REFERENCES:
patent: 2001/0015321 (2001-08-01), Reid et al.
patent: 2002/0036145 (2002-03-01), Dubin et al.
patent: 2002/0112964 (2002-08-01), Gandikota et al.
Dubin Valery
Jentz David
McGregor Paul
Rastogi Rajiv
Viswanathan Ramesh
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Leader William T
Tsang-Foster Susy
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