Single step salicidation process

Details Single step salicidation process Single step salicidation process

1992-09-28

1994-02-15

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437192, H01L 2128

Patent

active

052866785

ABSTRACT:
The present invention generally involves the fabrication of semiconductor devices so as to reduce the active region to interconnect interface resistivity. Fabrication begins by forming active regions on a semiconductor device. Next, a titanium metal of approximately 900 .ANG. thickness is deposited on the semiconductor device. The semiconductor device is then annealed in a single step to form the interconnects.

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