4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Rajen Dias

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Backside metallization on microelectronic dice having...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Backside metallization on microelectronic dice having...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Backside metallization on sides of microelectronic dice for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Backside metallization on sides of microelectronic dice for...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Microelectronic device interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Rajen Dias does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Rajen Dias, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Rajen Dias will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2425863

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure