Microelectronic device interconnects

Details Microelectronic device interconnects Microelectronic device interconnects

2006-07-18

2006-07-18

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S773000, C257S782000

Reexamination Certificate

active

07078822

ABSTRACT:
A microelectronic assembly including a plurality of conductive columns extending from a bond pad of a microelectronic device and a conductive adhesive on a land pad of a carrier substrate electrically attached to the conductive columns.

REFERENCES:
patent: 5739587 (1998-04-01), Sato
patent: 6593643 (2003-07-01), Seki et al.
Wolf et al., Silicon Processing for the VLSI Era, 2000, vol. I, Lattice Press, 851-852.

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