4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Die bond

Rahul N. Manepalli

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Adhesive of folded package

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Capillary-flow underfill compositions, packages containing...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Die-attach films for chip-scale packaging, packages made...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Nitrogen-containing reactant
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Directing the flow of underfill materials using magnetic...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Methods and systems for attaching die in stacked-die packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Rahul N. Manepalli does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Rahul N. Manepalli, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Rahul N. Manepalli will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2194553

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure