Methods and systems for attaching die in stacked-die packages

Details Methods and systems for attaching die in stacked-die packages Methods and systems for attaching die in stacked-die packages

2007-05-29

2007-05-29

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S686000, C257S723000, C257S784000, C257S777000, C257SE23116

Reexamination Certificate

active

10918585

ABSTRACT:
A system and a method for producing a multiple-die device by attaching a die to a substrate using a first die-attach material having a first processing temperature and attaching a subsequent die using a second die-attach material having a second processing temperature such that the process of attaching the second die does not degrade the first die-attach material. For one embodiment, multiple dies are attached using each die-attach material. For one embodiment, the first die-attach material is a thermoplastic film and the second and subsequent die-attach materials are reformulations of the thermoplastic film.

REFERENCES:
patent: 5709957 (1998-01-01), Chiang et al.
patent: 5963794 (1999-10-01), Fogal et al.
patent: 2002/0151103 (2002-10-01), Nakamura et al.
patent: 2003/0101583 (2003-06-01), Tandy
patent: 2003/0102573 (2003-06-01), Tanabe et al.
patent: 2003/0141014 (2003-07-01), Satoyuki et al.
patent: 2004/0245651 (2004-12-01), Nishisako et al.
PCT International Search Report and Written Opinion of the International Searching Authority for PCT/US2005/026940, mailed Dec. 27, 2005, 11 pages.

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