Adhesive of folded package

Details Adhesive of folded package Adhesive of folded package

2006-04-25

2006-04-25

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S645000

Reexamination Certificate

active

07033911

ABSTRACT:
A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.

REFERENCES:
patent: 6869825 (2005-03-01), Chiu
patent: 6879047 (2005-04-01), Heo
patent: 2004/0124527 (2004-07-01), Chiu

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