Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-08-30
2011-08-30
Chen, Xiaoliang (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S305000, C029S832000, C438S106000, C438S120000, C438S612000, C257S728000, C257S787000
Reexamination Certificate
active
08009442
ABSTRACT:
Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate and a die, and coupling the die to the substrate, wherein a gap remains between the die and the substrate. The method also includes placing an underfill material on the substrate and delivering at least part of the underfill material into the gap. The method also includes controlling the flow of the underfill material in the gap using magnetic force. Other embodiments are described and claimed.
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Arana Leonel R.
Chan Wendy
Lehman, Jr. Stephen E.
Manepalli Rahul N.
Chen Xiaoliang
Intel Corporation
Konrad Raynes & Victor LLP
Raynes Alan S.
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