4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Phoenix Precision Technology Corporation

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Attachment of a stiff heat spreader for fabricating a cavity...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Carrier structure for semiconductor chip and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Carrying structure of electronic components

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Chip embedded package structure and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – Bidirectional rectifier with control electrode
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Circuit barrier structure of semiconductor packaging...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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