4. Metal fusion bonding
  5. Process
  6. Specific mode of heating or applying pressure

Peter Tolchinsky

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Complete device layer transfer without edge exclusion via...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...
Reexamination Certificate

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Complete device layer transfer without edge exclusion via...

Metal fusion bonding – Process – Specific mode of heating or applying pressure
Reexamination Certificate

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Dual crystal orientation circuit devices on the same substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...
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High mobility tri-gate devices and methods of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Non-single crystal – or recrystallized – material with...
Reexamination Certificate

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Methods and apparatuses for manufacturing ultra thin device...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
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Profile ID: LFUS-PAI-P-2885032

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