4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Physical configuration of semiconductor
  6. With electrical contact in hole in semiconductor

Peter J. Lindgren

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Dual-damascene process to fabricate thick wire structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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IC chip and design structure with through wafer vias dishing...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Metal wiring structure for integration with through...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
Reexamination Certificate

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Optimal tungsten through wafer via and process of...

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate

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Sublithographic patterning using microtrenching

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2326032

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