4. Stock material or miscellaneous articles
  5. Structurally defined web or sheet
  6. Including sheet or component perpendicular to plane of web...

Paul F. Findeis

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Apparatus and method for plating pin grid array packaging module

Coating processes – Nonuniform coating – Mask or stencil utilized
Patent

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Apparatus and method for use in manufacturing semiconductor devi

Metal fusion bonding – Including means to apply flux or filler to work or applicator
Patent

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Apparatus and method for use in manufacturing semiconductor...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Apparatus for providing solder interconnections to semiconductor

Stock material or miscellaneous articles – Structurally defined web or sheet – Including sheet or component perpendicular to plane of web...
Patent

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Plating structure for a pin grid array package

Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent

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Profile ID: LFUS-PAI-P-1270595

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