Apparatus and method for use in manufacturing semiconductor devi

Details Apparatus and method for use in manufacturing semiconductor devi Apparatus and method for use in manufacturing semiconductor devi

1998-04-08

2000-11-21

Ryan, Patrick

Metal fusion bonding

Including means to apply flux or filler to work or applicator

228 41, 228254, 2282481, 29874, 438612, 438613, B23K 100

Patent

active

061490482

ABSTRACT:
An apparatus for use in manufacturing a semiconductor device includes an input-output (IO) face having a plurality of IO lands, and is situated in an operating position in abutting relation with a depositor. The apparatus includes a first holding member holding the depositor in a first position; a second holding member holding the semiconductor device in the operating position. The depositor and the semiconductor device cooperate in the operating position to deposit solder ball connection structures to the IO lands. The apparatus further includes a separating member for moving at least one of the depositor and the semiconductor device from the operating position to an interim orientation. The interim orientation establishes a separation distance intermediate the depositor and the semiconductor device appropriate to disengage the solder ball connecting structures from the depositor.

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