Plating structure for a pin grid array package

Details Plating structure for a pin grid array package Plating structure for a pin grid array package

1998-01-12

2000-04-18

Bell, Bruce F.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204297R, 205 78, 205122, 29825, C25D 1704

Patent

active

060511192

ABSTRACT:
Disclosed is a plating structure including a substrate having a plurality of pins to be plated and a metallic plating screen having a plurality of apertures, wherein each of the apertures has at least two tabs spaced apart from each other, wherein the metallic plating screen is placed over the pins so that at least two pins penetrate each aperture, each of the pins contacting a tab of the aperture. Also disclosed is a method of electrolytically plating a plurality of pins utilizing the above metallic plating screen.

REFERENCES:
patent: 4949455 (1990-08-01), Nakamura et al.
patent: 5022976 (1991-06-01), Roll et al.
patent: 5087331 (1992-02-01), Roll et al.
patent: 5342992 (1994-08-01), Noto
patent: 5516416 (1996-05-01), Canaperi et al.
patent: 5580432 (1996-12-01), Shibata et al.
patent: 5869139 (1999-02-01), Biggs et al.

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