4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Patrick Morrow

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Bonded wafer processing method

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Deposition of diffusion barrier

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Dual-damascene interconnects without an etch stop layer by...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Integrated on-chip NMR and ESR device and method for making...

Electricity: measuring and testing – Particle precession resonance – Spectrometer components
Reexamination Certificate

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Method for making a dual damascene interconnect using a dual...

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2284709

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