4. Metal fusion bonding
  5. Process
  6. Plural joints

Pac Tech-Packaging Technologies GmbH

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Bump with basic metallization and method for manufacturing...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Chip carrier device and method for the production of a chip...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
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Chips arranged in plurality of planes and electrically...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Device for applying solder globules

Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
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Device for removing solder material from a soldered joint

Electric heating – Metal heating – By arc
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Profile ID: LFUS-PAI-P-1557061

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