Device for applying solder globules

Details Device for applying solder globules Device for applying solder globules

2005-07-12

2005-07-12

Cooke, Colleen P. (Department: 1754)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Solid flux or solid filler

C228S005500, C228S049500

Reexamination Certificate

active

06915940

ABSTRACT:
An apparatus for applying solder balls to a substrate and for remelting the solder balls on soldering points of the substrate has a capillary for supplying a solder ball to the soldering points and for placing the solder ball at the free end of the capillary opposite the soldering point, a means for supplying heat to the solder ball to remelt it, and a pressing apparatus for holding down the substrate to prevent the substrate from being resilient when placing and remelting the solder ball.

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patent: 201 06 464 (2001-09-01), None
patent: 1 029 626 (2000-08-01), None
patent: WO 95/00279 (1995-01-01), None

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