Device for removing solder material from a soldered joint

Electric heating – Metal heating – By arc

Reexamination Certificate

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Details

C219S121650, C228S264000, C228S019000

Reexamination Certificate

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07829817

ABSTRACT:
In a basic variant of a soldering device whereby a laser device is used for melting solder material (3), a protective device is provided which protects the laser lens system (22) from suctioned liquid solder material. Protection of the laser lens system can be achieved by a transverse flow from an inlet channel (23) into an outlet channel (24) and/or by a diaphragm (39) arranged in front of the laser lens system.

REFERENCES:
patent: 3987954 (1976-10-01), Litt
patent: 5560531 (1996-10-01), Ruszowski
patent: 5579979 (1996-12-01), Kurpiela
patent: 6119919 (2000-09-01), Kasulke
patent: 6224180 (2001-05-01), Pham-Van-Diep et al.
patent: 6550669 (2003-04-01), Walz et al.
patent: 32 08 626 (1983-09-01), None
patent: 38 22 097 (1990-01-01), None
patent: 39 31 401 (1991-03-01), None
patent: 41 43 414 (1993-07-01), None
patent: 0 635 329 (1995-01-01), None
patent: 1-133672 (1989-05-01), None
patent: 2-18990 (1990-01-01), None
patent: WO 98/57774 (1998-12-01), None
Kaskule, Paul, English Translation of WO 98/57774, 17 pages, Dec. 1998.
Patent Abstracts of Japan, Sucking Jig for Solder, No. JP 01133672, published May 25, 1989, Hitachi.

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