Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-04-17
2007-04-17
Owens, Douglas W. (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S622000
Reexamination Certificate
active
10893087
ABSTRACT:
A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and the molten plastic during the encapsulation of the leadframe and thereby reduces the tendency of the package to separate when exposed to moisture and numerous temperature cycles. In one embodiment, the leadframe made of copper is roughened with a chemical etchant that contains sulfuric acid and hydrogen peroxide.
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Chua Yee Heong
Layson Arlene V.
Nondhasitthichai Somchai
Sirinorakul Saravuth
NS Electronics Bangkok (1993) Ltd.
Owens Douglas W.
Silicon Valley Patent & Group LLP
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