4. Electric heating
  5. Metal heating
  6. By arc

Ninao Sato

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Method of dividing a semiconductor wafer utilizing a laser...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Semiconductor device obtained by dividing semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
Reexamination Certificate

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Semiconductor wafer dividing apparatus and semiconductor...

Electric heating – Metal heating – By arc
Reexamination Certificate

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Semiconductor wafer dividing method and apparatus

Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2786271

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