Method of dividing a semiconductor wafer utilizing a laser...

Details Method of dividing a semiconductor wafer utilizing a laser... Method of dividing a semiconductor wafer utilizing a laser...

2006-11-21

2006-11-21

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S462000, C438S463000, C257S797000

Reexamination Certificate

active

07138297

ABSTRACT:
A semiconductor chip is formed by dividing a semiconductor wafer by use of the laser dicing technique. The semiconductor chip has a laser dicing region on the side surface thereof. A dummy wiring layer is formed along the laser dicing region on the surface layer of the laser dicing region. A laser beam is applied to the dummy wiring layer to divide the semiconductor wafer.

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