4. Active solid-state devices (e.g., transistors, solid-state diode
  5. With means to control surface effects
  6. Insulating coating

Nikhil Vishwanath Kelkar

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active

Barrier pad for wafer level chip scale packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
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Chip scale package with compliant leads

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Reexamination Certificate

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Chip scale package with compliant leads

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having air-gap dielectric
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Encapsulant material applicator for semiconductor wafers and...

Coating apparatus – Immersion or work-confined pool type – Mask or stencil
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Marking semiconductor devices through a mount tape

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1613329

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