Marking semiconductor devices through a mount tape

Details Marking semiconductor devices through a mount tape Marking semiconductor devices through a mount tape

2005-12-06

2005-12-06

Baumeister, B. William (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C219S121620, C219S121680, C264S400000, C264S482000, C257S797000

Reexamination Certificate

active

06972244

ABSTRACT:
Wafer level techniques for marking the back surfaces of integrated circuit devices are described. The back surface of the wafer is laser marked while being supported by a mount tape. In some embodiments, the mount tape is sufficiently transparent that the laser light passes through the mount tape and marks the back surface of the wafer. In other embodiments, the laser may actually burn the mounting tape (or portions thereof) during the marking process. The marking may be done on any suitable back surface material including polymeric backcoatings, metalized films or directly on semiconductor materials.

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