4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Nghia Thuc Tu

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Apparatus and method for miniature semiconductor packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Apparatus and method for miniature semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Die attach method and leadframe structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Die attach method and microarray leadframe structure

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Thin foil semiconductor package

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3066449

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