Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-01-09
2007-01-09
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257SE23039, C257S678000, C257S668000, C257S684000
Reexamination Certificate
active
10942061
ABSTRACT:
A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent the semiconductor chip. Electrical connections are formed between the contacts and the semiconductor chip. An adhesive tape provided adjacent the non-active surface of the semiconductor chip and the one or more contacts positioned adjacent the semiconductor chip. An adhesive material provided between the non-active surface of the chip and the adhesive tape.
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National Semiconductor Corporation, “Leadless Leadframe Package(LLP)” AN-1187, Mar. 2004, 21 pages.
Lee Shaw Wei
Nadarajah Santhiran S O
Soon Lim Peng
Tu Nghia Thuc
Beyer Weaver & Thomas LLP
Chu Chris C.
National Semiconductor Corporation
Parker Kenneth
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