Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2006-12-01
2008-09-02
Chu, Chris C. (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S119000, C438S628000, C438S508000, C257SE23127, C257S676000, C257S783000
Reexamination Certificate
active
07419855
ABSTRACT:
A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent the semiconductor chip. Electrical connections are formed between the contacts and the semiconductor chip. An adhesive tape provided adjacent the non-active surface of the semiconductor chip and the one or more contacts positioned adjacent the semiconductor chip. An adhesive material provided between the non-active surface of the chip and the adhesive tape.
REFERENCES:
patent: 4480013 (1984-10-01), Doi et al.
patent: 4550333 (1985-10-01), Ridder et al.
patent: 5175060 (1992-12-01), Enomoto et al.
patent: 5304843 (1994-04-01), Takubo et al.
patent: 5471088 (1995-11-01), Song
patent: 5614316 (1997-03-01), Hashimoto et al.
patent: 5818105 (1998-10-01), Kouda
patent: 5859471 (1999-01-01), Kuraishi et al.
patent: 5866939 (1999-02-01), Shin et al.
patent: 6060768 (2000-05-01), Hayashida et al.
patent: 6132865 (2000-10-01), Oka et al.
patent: 6201292 (2001-03-01), Yagi et al.
patent: 6265782 (2001-07-01), Yamamoto et al.
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6294100 (2001-09-01), Fan et al.
patent: 6300673 (2001-10-01), Hoffman et al.
patent: 6429508 (2002-08-01), Gang
patent: 6673441 (2004-01-01), Tanaka et al.
patent: 7161232 (2007-01-01), Lee et al.
patent: 09283661 (1997-10-01), None
patent: 11260972 (1999-09-01), None
patent: 2002184801 (2002-06-01), None
National Semiconductor Corporation, “Leadless Leadframe Package(LLP)” AN-1187, Mar. 2004, 21 pages.
Lee Shaw Wei
Nadarajah Santhiran S O
Soon Lim Peng
Tu Nghia Thuc
Beyer Law Group LLP
Chu Chris C.
National Semiconductor Corporation
LandOfFree
Apparatus and method for miniature semiconductor packages does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for miniature semiconductor packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for miniature semiconductor packages will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3983039