Die attach method and microarray leadframe structure

Details Die attach method and microarray leadframe structure Die attach method and microarray leadframe structure

2006-03-08

2009-10-06

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S118000, C438S127000, C257SE21503

Reexamination Certificate

active

07598122

ABSTRACT:
In one aspect of the invention, a method of attaching a semiconductor die to a microarray leadframe is described. The method comprises stamping an adhesive onto discrete areas of the microarray leadframe using a multi-pronged stamp tool. The adhesive is applied to the leadframe as a series of dots, each dot corresponding to an associated prong of the stamping tool. In some embodiments the adhesive used to attach the semiconductor die to a leadframe is a black epoxy based adhesive material. In an apparatus aspect of the invention, lead traces in a microarray leadframe are arranged to have tails that extend beyond their associated contact posts on the side of the contact post that is opposite a wire bonding region such that such lead traces extends on two opposing sides of their associated contact posts. The tails do not attach to other structures within the lead frame (such as a die attach structure). The width of at least some of these tailed lead traces in a region that overlies their associated contact post is narrower than their associated contact post. Thus, these narrowed lead traces have extensions that extend beyond their associated contact posts. The extensions provide additional surface area that gives an adhesive applied to the narrowed lead trace (as for example by stamping) room to bleed (flow) along the top surface of the lead trace on both sides of the associated contact pad.

REFERENCES:
patent: 5816158 (1998-10-01), Ross
patent: 6774659 (2004-08-01), Chiang
patent: 2004/0089929 (2004-05-01), Chiu et al.

Affiliated with

Also associated with

Rating

Die attach method and microarray leadframe structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die attach method and microarray leadframe structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die attach method and microarray leadframe structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4125329