4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Nga Doan

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Capacitor electrode, method for manufacturing the same, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Chip package and method for fabricating the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Component for an information display device

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
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Electronic component comprising a titanium carbonitride...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Electronic devices including offset conductive bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Profile ID: LFUS-PAI-P-2178163

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