Chip package and method for fabricating the same

Details Chip package and method for fabricating the same Chip package and method for fabricating the same

2007-08-10

2009-08-04

Cao, Phat X (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S110000, C257SE21596

Reexamination Certificate

active

07569422

ABSTRACT:
A method for fabricating chip package includes providing a semiconductor chip with a metal bump, next adhering the semiconductor chip to a substrate using a glue material, next forming a polymer material on the substrate, on the semiconductor chip, and on the metal bump, next polishing the polymer material, next forming a patterned circuit layer over the polymer material and connected to the metal bump, and then forming a tin-containing ball over the patterned circuit layer and connected to the patterned circuit layer.

REFERENCES:
patent: 6521996 (2003-02-01), Seshan
patent: 6607970 (2003-08-01), Wakabayashi
patent: 6673698 (2004-01-01), Lin et al.
patent: 6800941 (2004-10-01), Lee et al.
patent: 2003/0215980 (2003-11-01), Otaki
patent: 2005/0224966 (2005-10-01), Fogel et al.
patent: 2007/0205520 (2007-09-01), Chou et al.

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