4. Metal fusion bonding
  5. Process
  6. Plural joints

Naofumi Iwamoto

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High frequency probe for examining electric characteristics...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Method of manufacturing semiconductor chip having supporting...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Semiconductor chip having a supporting member, tape...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Semiconductor device and mounting method therefor

Metal fusion bonding – Process – Plural joints
Patent

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Silicon electrode plate for plasma etching with superior...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – Having glow discharge electrode gas energizing means
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Profile ID: LFUS-PAI-P-1108160

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