Method of manufacturing semiconductor chip having supporting...

Details Method of manufacturing semiconductor chip having supporting... Method of manufacturing semiconductor chip having supporting...

2005-01-11

2005-01-11

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C438S612000

Reexamination Certificate

active

06841462

ABSTRACT:
A semiconductor chip includes a substrate having a main surface, the main surface including a flame-shaped first area, which is along sides of the main surface, and a second area encompassed by the first area, a pad formed in the first area and a bump electrode formed on the pad, and at least one supporting member formed in the second area.

REFERENCES:
patent: 5563445 (1996-10-01), Iijima et al.
patent: 5635756 (1997-06-01), Kohno et al.
patent: 6175157 (2001-01-01), Morifuji
patent: 6208022 (2001-03-01), Tamura
patent: 8-46313 (1996-02-01), None
patent: 11-87423 (1999-03-01), None
patent: 2000-195900 (2000-07-01), None
patent: 2000-243785 (2000-09-01), None
patent: 2001-110951 (2001-04-01), None

Affiliated with

Also associated with

Rating

Method of manufacturing semiconductor chip having supporting... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor chip having supporting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor chip having supporting... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3435849