Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – Having glow discharge electrode gas energizing means
Reexamination Certificate
2005-03-30
2010-10-26
Hassanzadeh, Parviz (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
Having glow discharge electrode gas energizing means
C156S345470
Reexamination Certificate
active
07820007
ABSTRACT:
This silicon electrode plate for plasma etching is a silicon electrode plate for plasma etching with superior durability including silicon single crystal which, in terms of atomic ratio, contains 3 to 11 ppba of boron, and further contains a total of 0.5 to 6 ppba of either or both of phosphorus and arsenic.
REFERENCES:
patent: 3852175 (1974-12-01), Hoekje
patent: 4554141 (1985-11-01), Scull et al.
patent: 5685949 (1997-11-01), Yashima
patent: 5951814 (1999-09-01), Saito et al.
patent: 5993597 (1999-11-01), Saito et al.
patent: 2002/0127853 (2002-09-01), Hubacek et al.
patent: 8-37179 (1996-02-01), None
patent: 10-17393 (1998-01-01), None
patent: 10-29894 (1998-02-01), None
patent: 2002-134518 (2002-05-01), None
patent: 2002-299345 (2002-10-01), None
patent: 2003-137687 (2003-05-01), None
International Search Report for PCT/JP2005/006134 completed May 19, 2005.
Japanese Office Action mailed Jul. 30, 2009 for the corresponding Japanese Patent Application No. 2004-234961.
Fujiwara Hideki
Ikezawa Kazuhiro
Ishii Toshinori
Iwamoto Naofumi
Komekyu Takashi
Crowell Michelle
Hassanzadeh Parviz
Leason Ellis LLP
Mitsubishi Materials Corporation
Sumco Corporation
LandOfFree
Silicon electrode plate for plasma etching with superior... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Silicon electrode plate for plasma etching with superior..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Silicon electrode plate for plasma etching with superior... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4173171