Semiconductor device and mounting method therefor

Details Semiconductor device and mounting method therefor Semiconductor device and mounting method therefor

1997-05-16

2000-02-01

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

2282351, 228255, B23K 3102, B23K 3512

Patent

active

060192747

ABSTRACT:
A reflow mounting method and a semiconductor device for efficient manufacture of TCPs superior in reliability by preventing the deformation of leads and ensuring a dependable contact between the bonding pads on a circuit board and the leads, wherein metal pieces arranged as weights on the leads are temporarily positioned adequately to specified bonding pads, thus restraining the leads from shifting from appropriate positions, which may occur if the leads deform, and wherein the metal pieces become wettable by bonding agent when heated, thus making sure that the leads are firmly fixed between the metal pieces and the bonding pads.

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patent: 5817208 (1998-10-01), Nose et al.
"Fine Pitch Attachment Process Using A Polymide-Solder Preform," IBM Technical Disclosure Bulletin, vol. 33, No. 1A, pp. 401-402, Jun. 1990.
"Constant Heat-Soldering Method Using Metal Wire," IBM Technical Disclosure Bulletin, vol. 39, No. 4, pp. 103-104, Apr. 1996.

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