4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Die bond

Nancy C. LaBianca

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Bilayer wafer-level underfill

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Heterogeneous thermal interface for cooling

Heat exchange – With retainer for removable article – Electrical component
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Method and apparatus for chip-cooling

Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate

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Negative thermal expansion system (NTEs) device for TCE...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Packaging integrated circuits for accelerated detection of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Profile ID: LFUS-PAI-P-2568665

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