Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2006-06-20
2006-06-20
Walberg, Teresa J. (Department: 3753)
Heat exchange
With retainer for removable article
Electrical component
C165S080400, C165S185000
Reexamination Certificate
active
07063127
ABSTRACT:
A thermal interface for IC chip cooling is provided. One embodiment of the thermal interface includes a thermally conductive liquid or paste-like metal(s) disposed within a flexible, thermally conductive enclosure. The enclosure is adapted to be placed between an IC chip and a heat sink to enhance heat transfer from the chip to the heat sink, thereby enabling quicker and more efficient cooling of the chip than can be achieved by conventional techniques. In several embodiments, the thermal interface is held in place by mechanical pressure rather than by bonding, which further facilitates inspection and repair of the IC device.
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Gelorme Jeffrey D.
Hamann Hendrik F.
LaBianca Nancy C.
Martin Yves C.
Van Kessel Theodore G.
Cheung, Esq. Wan Yee
Walberg Teresa J.
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