Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-08-02
2005-08-02
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S107000, C438S113000, C438S114000
Reexamination Certificate
active
06924171
ABSTRACT:
Methods for fabricating microelectronic interconnection structures as well as the structures formed by the methods are disclosed which improve the manufacturing throughput for assembling flip chip semiconductor devices. The use of a bilayer of polymeric materials applied on the wafer prior to dicing eliminates the need for dispensing and curing underfill for each semiconductor at the package level, thereby improving manufacturing throughput and reducing cost.
REFERENCES:
patent: 3943623 (1976-03-01), Mizutani et al.
patent: 4681654 (1987-07-01), Clementi et al.
patent: 5153986 (1992-10-01), Brauer et al.
patent: 5319244 (1994-06-01), Papathomas et al.
patent: 5895229 (1999-04-01), Carney et al.
patent: 5909634 (1999-06-01), Hotchkiss et al.
patent: 5930598 (1999-07-01), Wille et al.
patent: 5975408 (1999-11-01), Goossen
patent: 6228678 (2001-05-01), Gilleo et al.
patent: 6346296 (2002-02-01), McCarthy et al.
patent: 6372544 (2002-04-01), Halderman et al.
patent: 6410415 (2002-06-01), Estes et al.
patent: 6506681 (2003-01-01), Grigg et al.
patent: 6656750 (2003-12-01), Datta et al.
patent: 6774493 (2004-08-01), Capote et al.
patent: 2002/0105092 (2002-08-01), Coyle
patent: 2003/0199160 (2003-10-01), Farnworth et al.
Buchwalter Stephen L.
Danovitch David
Doany Fuad Elias
Feger Claudius
Gruber Peter A.
Coleman W. David
International Business Machines - Corporation
Morris, Esq. Daniel P.
Nguyen Khiem
Scully Scott Murphy & Presser
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