Heterogeneous thermal interface for cooling

Details Heterogeneous thermal interface for cooling Heterogeneous thermal interface for cooling

2007-05-22

2007-05-22

Walberg, Teresa J. (Department: 3744)

Heat exchange

With retainer for removable article

Electrical component

C165S185000

Reexamination Certificate

active

11037913

ABSTRACT:
The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.

REFERENCES:
patent: 4225561 (1980-09-01), Torres
patent: 5198189 (1993-03-01), Booth et al.
patent: 5365402 (1994-11-01), Hatada et al.
patent: 6037658 (2000-03-01), Brodsky et al.
patent: 6301109 (2001-10-01), Chu et al.
patent: 6665186 (2003-12-01), Calmidi et al.
patent: 6946190 (2005-09-01), Bunyan
patent: 2003/0187116 (2003-10-01), Misra et al.
patent: 2005/0155752 (2005-07-01), Larson et al.
R.R. Schmidt, B.D. Notohardjono, “High-end Server Low-temperature Cooling”, IBM Technical Disclosure Bulletin, Nov. 2002, pp. 739-751.

Affiliated with

Also associated with

Rating

Heterogeneous thermal interface for cooling does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heterogeneous thermal interface for cooling, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heterogeneous thermal interface for cooling will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3796709