4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Nancy A. Greco

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Integrated circuit having crack stop for interlevel dielectric l

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects
Patent

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Laser ablation for plasma etching endpoint detection

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Metal deposition process for metal lines over topography

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Method and apparatus for copper corrosion prevention during...

Electrolysis: processes – compositions used therein – and methods – Electrolytic material treatment – Metal or metal alloy
Reexamination Certificate

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Method for producing a crack stop for interlevel dielectric...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-586466

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