Method and apparatus for copper corrosion prevention during...

Details Method and apparatus for copper corrosion prevention during... Method and apparatus for copper corrosion prevention during...

2006-05-11

2008-12-23

Bell, Bruce F (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic material treatment

Metal or metal alloy

C205S725000, C205S726000, C205S740000, C205S096000, C205S100000, C205S775500, C204S404000, C204S196020, C204S196370, C204S228100, C204S230200

Reexamination Certificate

active

07468124

ABSTRACT:
A method and apparatus for cleaning a wafer with a metal exposed through an insulator, through the use of a wet cleaning tank in concert with a feedback system on the potential difference between two leads of the wet cleaning tank. The cleaning tank has a bath in which the wafer and the two leads are immersed. The potential difference between the two leads is regulated when the feedback system detects a change in the potential across the two leads.

REFERENCES:
patent: 6558529 (2003-05-01), McVey et al.
patent: 7160582 (2007-01-01), Girard et al.
patent: 2003/0034046 (2003-02-01), Guldi
patent: 2003/0181342 (2003-09-01), Seijo et al.
patent: 2006/0234855 (2006-10-01), Gorte et al.

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