Laser ablation for plasma etching endpoint detection

Details Laser ablation for plasma etching endpoint detection Laser ablation for plasma etching endpoint detection

1990-03-30

1990-12-04

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156656, 1566591, 156662, 156345, 20419233, 21912169, H01L 21306, B44C 122, C23F 102, B29C 3700

Patent

active

049751417

ABSTRACT:
A method for detecting the endpoint in an etching process including the steps of: providing a structure to be etched including at least a first layer of material overlying a second layer of material; ablating an aperture in the first layer using a beam of coherent electromagnetic radiation so as to expose a portion of the second layer; exposing the structure to an etchant for etching the second layer; and monitoring the second layer using the ablated aperture so as to detect an endpoint for the etching process.

REFERENCES:
patent: 4198261 (1980-04-01), Busta et al.
patent: 4479848 (1984-10-01), Otsubo et al.
patent: 4496425 (1985-01-01), Kuyel
patent: 4611919 (1986-09-01), Brooks et al.
patent: 4687539 (1987-08-01), Burns et al.
patent: 4717446 (1988-01-01), Nagy et al.

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