Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
Examiner
active
No affiliations
Bottom lead semiconductor package having folded leads
Interconnection of a carrier substrate and a semiconductor devic
Non-contact IC card having insulated exposed leads
Semiconductor sensor device comprised of plural sensor chips con
Single event upset hardened memory cell
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Profile ID: LFUS-PAI-P-1086570