Semiconductor sensor device comprised of plural sensor chips con

Details Semiconductor sensor device comprised of plural sensor chips con Semiconductor sensor device comprised of plural sensor chips con

1993-04-27

1999-11-02

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Charge transfer device

257232, 257443, H01L 27148

Patent

active

059775750

ABSTRACT:
The semiconductor image sensor device of the multiple chip mount type is constructed such that electrical and mechanical connections are carried out concurrently among chips. Coupling chips 4 are utilized to couple a plurality of semiconductor image sensor chips 1 with each other, and the couple one semiconductor image sensor chip 1 to a driver substrate 3 which mounts thereon a semiconductor driving chip 2 for driving the semiconductor image sensor chips 1.

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patent: 5220210 (1993-06-01), Miwada
Hatada, Kenzo., et al., "LED array modules by New Method Micron Bump Bonding Method", IEE/CHMT '89 IEMT Symposium, pp. 230-233.

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