Interconnection of a carrier substrate and a semiconductor devic

Details Interconnection of a carrier substrate and a semiconductor devic Interconnection of a carrier substrate and a semiconductor devic

1997-05-09

1999-07-06

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257692, H01L 2348

Patent

active

059201258

ABSTRACT:
Solder interconnection for forming connections between an integrated semiconductor device and a carrier substrate is provided. Located on the carrier substrate are electrodes and located between the electrodes and integrated semiconductor device are solder connections that have a relatively low melting point such that when the device is in operation, the solder connection will liquify thereby permitting expansion compensation between the substrate and semiconductor device.

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Solder Joint Life Improvement Using Adhesive Under Component, Research Disclosure, Jan. 1990, No. 309, Kenneth Mason Publications Ltd., England.

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