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My Nguyen

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Electroless nickel immersion gold semiconductor flip chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Interface materials and methods of production and use thereof

Compositions – Electrically conductive or emissive compositions – Elemental carbon containing
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Interfacial strengthening for electroless nickel immersion...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Method of mounting an electroless nickel immersion gold flip...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Thermal interface materials

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...
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Profile ID: LFUS-PAI-P-2197632

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