4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Subsequent separation into plural bodies

Mohamad Shaheen

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Complete device layer transfer without edge exclusion via...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...
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Complete device layer transfer without edge exclusion via...

Metal fusion bonding – Process – Specific mode of heating or applying pressure
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III-V and II-VI compounds as template materials for growing...

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than... – Ii-vi compound
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Methods of vertically stacking wafers using porous silicon

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate

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Methods of vertically stacking wafers using porous silicon

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2410437

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