4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Gate arrays
  6. With particular chip input/output means

Mitsuaki Katagiri

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DRAM stacked package, DIMM, and semiconductor manufacturing...

Error detection/correction and fault detection/recovery – Pulse or data error handling – Digital logic testing
Reexamination Certificate

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Inductance analysis system and method and program therefor

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate

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Method for manufacturing semiconductor device, semiconductor...

Semiconductor device manufacturing: process – Making device array and selectively interconnecting – With electrical circuit layout
Reexamination Certificate

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Multichip package or system-in package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1395665

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