4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. Small lead frame for connecting a large lead frame to a...

Ming Ying

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Integrated circuit package system with die and package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Integrated circuit protruding pad package system

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Semiconductor package system with substrate having different...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor package system with substrate having different...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor package with passive device integration

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2175795

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